A chip type solid electrolytic capacitor includes a capacitor element-laminate. In the capacitor element-laminate, a plurality of capacitor elements, each having an anode portion and a cathode portion, are laminated so that the anode portions of the adjacent capacitor elements are disposed in the direction opposite to each other. Anode lead terminals are joined to the bottom faces of the anode portions of the capacitor elements disposed at both ends of the capacitor element-laminate. A cathode lead terminal is joined to the bottom face of the cathode portion of the capacitor element disposed in the center of the capacitor element-laminate. An Electrically insulating exterior resin coats the capacitor element-laminate so as to expose at least a part of the bottom faces of the anode lead terminals and a part of the cathode lead terminal.