发明授权
- 专利标题: Printed circuit board manufacturing equipment
- 专利标题(中): 印刷电路板制造设备
-
申请号: US12385895申请日: 2009-04-23
-
公开(公告)号: US07931065B2公开(公告)日: 2011-04-26
- 发明人: Satoshi Takeuchi , Atusi Sakaida , Toshihisa Taniguchi , Toshikazu Harada , Maki Chiba
- 申请人: Satoshi Takeuchi , Atusi Sakaida , Toshihisa Taniguchi , Toshikazu Harada , Maki Chiba
- 申请人地址: JP Kariya
- 专利权人: DENSO CORPORATION
- 当前专利权人: DENSO CORPORATION
- 当前专利权人地址: JP Kariya
- 代理机构: Posz Law Group, PLC
- 优先权: JP2008-112988 20080423
- 主分类号: B32B37/00
- IPC分类号: B32B37/00
摘要:
In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.
公开/授权文献
- US20090266492A1 Printed circuit board manufacturing equipment 公开/授权日:2009-10-29