发明授权
US07932161B2 Methods and materials useful for chip stacking, chip and wafer bonding
有权
用于芯片堆叠，芯片和晶片接合的方法和材料
- 专利标题： Methods and materials useful for chip stacking, chip and wafer bonding
- 专利标题（中）： 用于芯片堆叠，芯片和晶片接合的方法和材料
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申请号： US11726354申请日： 2007-03-21
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公开(公告)号： US07932161B2公开(公告)日： 2011-04-26
- 发明人: Chris Apanius , Robert A. Shick , Hendra Ng , Andrew Bell , Wei Zhang , Phil Neal
- 申请人： Chris Apanius , Robert A. Shick , Hendra Ng , Andrew Bell , Wei Zhang , Phil Neal
- 申请人地址： US OH Brecksville
- 专利权人： Promerus LLC
- 当前专利权人： Promerus LLC
- 当前专利权人地址： US OH Brecksville
- 代理机构： The Webb Law Firm
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/46
摘要：
Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.
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