发明授权
- 专利标题: Light emitting diode module
- 专利标题(中): 发光二极管模块
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申请号: US12330968申请日: 2008-12-09
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公开(公告)号: US07935971B2公开(公告)日: 2011-05-03
- 发明人: Min Sang Lee , Tae Hong Lee , Won Hoe Koo , Kyung Seob Oh
- 申请人: Min Sang Lee , Tae Hong Lee , Won Hoe Koo , Kyung Seob Oh
- 申请人地址: KR Gyunggi-Do
- 专利权人: Samsung Led Co. Ltd.
- 当前专利权人: Samsung Led Co. Ltd.
- 当前专利权人地址: KR Gyunggi-Do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2008-0081212 20080820
- 主分类号: H01L27/15
- IPC分类号: H01L27/15
摘要:
The present invention relates to a light emitting diode module capable of facilitating the connection between light emitting diode modules.The present invention provides a light emitting diode module including an insulating layer, a first circuit pattern layer and a second circuit pattern layer which are stacked on a top surface and a bottom surface of the insulating layer respectively and have one ends protruding to an outside of the insulating layer and the other ends positioned inside the insulating layer, a solder resist layer coated on the first circuit pattern layer, a first via formed vertically through a portion of the solder resist layer to be electrically connected to the first circuit pattern layer, a second via formed vertically through a portion of the solder resist layer and the insulating layer to be electrically connected to the second circuit pattern layer and a light emitting element mounted on the solder resist layer.
公开/授权文献
- US20100044742A1 LIGHT EMITTING DIODE MODULE 公开/授权日:2010-02-25
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