Light emitting diode module
    1.
    发明授权
    Light emitting diode module 有权
    发光二极管模块

    公开(公告)号:US07935971B2

    公开(公告)日:2011-05-03

    申请号:US12330968

    申请日:2008-12-09

    IPC分类号: H01L27/15

    摘要: The present invention relates to a light emitting diode module capable of facilitating the connection between light emitting diode modules.The present invention provides a light emitting diode module including an insulating layer, a first circuit pattern layer and a second circuit pattern layer which are stacked on a top surface and a bottom surface of the insulating layer respectively and have one ends protruding to an outside of the insulating layer and the other ends positioned inside the insulating layer, a solder resist layer coated on the first circuit pattern layer, a first via formed vertically through a portion of the solder resist layer to be electrically connected to the first circuit pattern layer, a second via formed vertically through a portion of the solder resist layer and the insulating layer to be electrically connected to the second circuit pattern layer and a light emitting element mounted on the solder resist layer.

    摘要翻译: 本发明涉及能够促进发光二极管模块之间的连接的发光二极管模块。 本发明提供了一种发光二极管模块,其包括绝缘层,第一电路图案层和第二电路图案层,它们分别堆叠在绝缘层的顶表面和底表面上,并且一端突出到 所述绝缘层和位于所述绝缘层内部的另一端,涂覆在所述第一电路图案层上的阻焊层,垂直穿过所述阻焊层的一部分而被电连接到所述第一电路图案层的第一通孔, 第二通孔垂直穿过阻焊层的一部分和与第二电路图案层电连接的绝缘层和安装在阻焊层上的发光元件。

    LIGHT EMITTING DIODE MODULE
    2.
    发明申请
    LIGHT EMITTING DIODE MODULE 有权
    发光二极管模块

    公开(公告)号:US20100044742A1

    公开(公告)日:2010-02-25

    申请号:US12330968

    申请日:2008-12-09

    IPC分类号: H01L33/00

    摘要: The present invention relates to a light emitting diode module capable of facilitating the connection between light emitting diode modules.The present invention provides a light emitting diode module including an insulating layer, a first circuit pattern layer and a second circuit pattern layer which are stacked on a top surface and a bottom surface of the insulating layer respectively and have one ends protruding to an outside of the insulating layer and the other ends positioned inside the insulating layer, a solder resist layer coated on the first circuit pattern layer, a first via formed vertically through a portion of the solder resist layer to be electrically connected to the first circuit pattern layer, a second via formed vertically through a portion of the solder resist layer and the insulating layer to be electrically connected to the second circuit pattern layer and a light emitting element mounted on the solder resist layer.

    摘要翻译: 本发明涉及能够促进发光二极管模块之间的连接的发光二极管模块。 本发明提供了一种发光二极管模块,其包括绝缘层,第一电路图案层和第二电路图案层,它们分别堆叠在绝缘层的顶表面和底表面上,并且一端突出到 所述绝缘层和位于所述绝缘层内部的另一端,涂覆在所述第一电路图案层上的阻焊层,垂直穿过所述阻焊层的一部分而被电连接到所述第一电路图案层的第一通孔, 第二通孔垂直穿过阻焊层的一部分和与第二电路图案层电连接的绝缘层和安装在阻焊层上的发光元件。

    LIGHTING APPARATUS
    4.
    发明申请
    LIGHTING APPARATUS 审中-公开
    照明设备

    公开(公告)号:US20150085503A1

    公开(公告)日:2015-03-26

    申请号:US14240308

    申请日:2011-08-23

    摘要: An illuminating device includes a light source module; a heat radiator including a heat radiating plate having a cavity open toward a front surface thereof and receiving the light source module therein and ventilation holes disposed along an edge of the cavity, and heat radiating fins extending to a rear surface of the heat radiating plate, disposed in a radial manner along an edge of the heat radiating plate and positioned between the ventilation holes to form ventilation channels therebetween communicating with the ventilation holes; a cooler fixed to the heat radiator to be in contact with ends of the heat radiating fins and including air jet holes allowing air to be blown toward the heat radiator; and an electrical connector connected to the light source module and the cooler and supplying electrical signals thereto.

    摘要翻译: 照明装置包括光源模块; 散热器,具有散热板,所述散热板具有朝向其前表面开口的腔并且容纳所述光源模块,并且沿着所述空腔的边缘设置的通风孔以及散热片延伸到所述散热板的后表面, 沿着散热板的边缘以径向方式设置并定位在通气孔之间,以在其间形成与通气孔连通的通风通道; 固定到散热器的冷却器与散热片的端部接触,并且包括允许空气朝向散热器吹送的空气喷射孔; 以及连接到光源模块和冷却器并且向其提供电信号的电连接器。