发明授权
- 专利标题: Method of manufacturing circuit board
- 专利标题(中): 电路板制造方法
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申请号: US11976072申请日: 2007-10-19
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公开(公告)号: US07937833B2公开(公告)日: 2011-05-10
- 发明人: Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
- 申请人: Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
- 申请人地址: KR Suwon
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2006-0105924 20061030
- 主分类号: H03K3/02
- IPC分类号: H03K3/02
摘要:
A method of manufacturing a circuit board is disclosed. A method of manufacturing a circuit board that includes forming a first circuit pattern on the insulation layer of a carrier, in which an insulation layer and a first seed layer are stacked in order; stacking and pressing the carrier and an insulation board with the side of the carrier having the first circuit pattern facing the insulation board; removing the carrier to transfer the first circuit pattern and the insulation layer onto the insulation board; and forming a second circuit pattern on the insulation layer transferred to the insulation board, allows fine pitch circuit patterns to enable the manufacture of fine circuit patterns of high density on the board, and allows the manufacture of a multi-layer circuit board with a simple process.
公开/授权文献
- US20080098597A1 Method of manufacturing circuit board 公开/授权日:2008-05-01
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