Invention Grant
US07939224B2 Mask with registration marks and method of fabricating integrated circuits
有权
具有配准标记的掩模和制造集成电路的方法
- Patent Title: Mask with registration marks and method of fabricating integrated circuits
- Patent Title (中): 具有配准标记的掩模和制造集成电路的方法
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Application No.: US11855234Application Date: 2007-09-14
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Publication No.: US07939224B2Publication Date: 2011-05-10
- Inventor: Andreas Jahnke , Ralf Ziebold , Torsten Maehr
- Applicant: Andreas Jahnke , Ralf Ziebold , Torsten Maehr
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: G03F1/00
- IPC: G03F1/00 ; G03C5/00
Abstract:
A photomask for a lithography apparatus includes a chip pattern configured to be transferred into a resist layer on a workpiece and at least one registration mark that is configured not to be transferred into the resist layer. Mask qualification may be improved without impacting wafer level processes.
Public/Granted literature
- US20090075178A1 Mask with Registration Marks and Method of Fabricating Integrated Circuits Public/Granted day:2009-03-19
Information query
