发明授权
US07939364B2 Optimized lid attach process for thermal management and multi-surface compliant heat removal
有权
优化的盖子连接过程，用于热管理和多表面兼容的散热
- 专利标题： Optimized lid attach process for thermal management and multi-surface compliant heat removal
- 专利标题（中）： 优化的盖子连接过程，用于热管理和多表面兼容的散热
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申请号： US12121337申请日： 2008-05-15
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公开(公告)号： US07939364B2公开(公告)日： 2011-05-10
- 发明人: Vadim Gektin , Deviprasad Malladi
- 申请人： Vadim Gektin , Deviprasad Malladi
- 申请人地址： US CA Redwood City
- 专利权人： Oracle America, Inc.
- 当前专利权人： Oracle America, Inc.
- 当前专利权人地址： US CA Redwood City
- 代理机构： Osha • Liang LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A multi-surface compliant heat removal process includes: identifying one or more components to share a heat rejecting device, applying non-adhesive film to the one or more components, identifying a primary component of the one or more components, and applying phase change material on each of the one or more components other than the primary component. The phase change material is placed on top of the non-adhesive film. The process further includes placing the heat rejecting device on the corresponding one or more components and removing the heat rejecting device from the corresponding one or more components. The phase change material and the non-adhesive film remain with the heat rejecting device. The process also includes reflowing the phase change material on the heat rejecting device, removing the non-adhesive film from the heat rejecting device, placing a heatsink-attach thermal interface material on the one or more components, and placing the heat rejecting device on the corresponding one or more components.