发明授权
US07939907B2 Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device
失效
在公共半导体器件中包括数字半导体元件和模拟半导体元件的半导体器件
- 专利标题： Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device
- 专利标题（中）： 在公共半导体器件中包括数字半导体元件和模拟半导体元件的半导体器件
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申请号： US11755045申请日： 2007-05-30
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公开(公告)号： US07939907B2公开(公告)日： 2011-05-10
- 发明人: Hideki Osaka , Yutaka Uematsu , Eiichi Suzuki
- 申请人： Hideki Osaka , Yutaka Uematsu , Eiichi Suzuki
- 申请人地址： JP Kanagawa
- 专利权人： Renesas Electronics Corporation
- 当前专利权人： Renesas Electronics Corporation
- 当前专利权人地址： JP Kanagawa
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2006-155136 20060602
- 主分类号： H01L29/00
- IPC分类号： H01L29/00 ; H01L23/52
摘要：
High density mounting and power source sharing are achieved by a digital semiconductor element and an analog semiconductor element provided in a common semiconductor device. A power layer for analog operation is connected to one end of an EBG (Electromagnetic Band Gap) layer, a power layer for digital operation is connected to the other end of the EBG layer, ground terminals for the respective elements are connected to a common ground layer, and a ground layer for separating the power layer for analog operation and the EBG layer from each other is disposed between the power layer for analog operation and the EBG layer. Thereby, high density mounting is achieved along with reducing interference of the power source to an analog chip.
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