发明授权
- 专利标题： Semiconductor device and manufacturing method thereof
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US12258067申请日： 2008-10-24
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公开(公告)号： US07939925B2公开(公告)日： 2011-05-10
- 发明人: Yuki Koide , Kouichi Meguro
- 申请人： Yuki Koide , Kouichi Meguro
- 申请人地址： US CA Sunnyvale
- 专利权人： Spansion LLC
- 当前专利权人： Spansion LLC
- 当前专利权人地址： US CA Sunnyvale
- 优先权： JP2007-277308 20071025
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
A semiconductor package having a molding unit that seals bonding wires connected to electrode pads of a semiconductor chip is provided with through electrode units comprising bonding wires embedded therein and penetrating the molding unit. A leading end of the respective through electrode units is exposed from an upper surface of the molding unit and a lower surface of the molding unit.
公开/授权文献
- US20090267207A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日：2009-10-29
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