Invention Grant
- Patent Title: Case structure having conductive pattern and method of manufacturing the same
- Patent Title (中): 具有导电图案的壳体结构及其制造方法
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Application No.: US12185341Application Date: 2008-08-04
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Publication No.: US07940220B2Publication Date: 2011-05-10
- Inventor: Dae Seong Jeon , Sang Woo Bae , Jae Suk Sung
- Applicant: Dae Seong Jeon , Sang Woo Bae , Jae Suk Sung
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Agency: Lowe Hauptman Ham & Berner LLP
- Priority: KR10-2007-0084429 20070822
- Main IPC: H01Q1/24
- IPC: H01Q1/24
Abstract:
There is provided a case structure having a conductive pattern and a method of manufacturing the same. A case structure having a conductive pattern according to an aspect of the invention includes a case having at least one via hole formed therein; at least conductive pattern formed on an outer surface of the case; and a conductive via formed within the via hole and electrically connecting the at least one conductive pattern to a board inside the case.
Public/Granted literature
- US20090051602A1 CASE STRUCTURE HAVING CONDUCTIVE PATTERN AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-02-26
Information query
