Invention Grant
- Patent Title: Solid state imaging device having wirings with lateral extensions
- Patent Title (中): 具有侧向延伸线的固态成像装置
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Application No.: US11788925Application Date: 2007-04-23
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Publication No.: US07940328B2Publication Date: 2011-05-10
- Inventor: Takashi Abe , Ryoji Suzuki , Yoshiharu Kudoh
- Applicant: Takashi Abe , Ryoji Suzuki , Yoshiharu Kudoh
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JPP2006-145603 20060525
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
A solid-state imaging device is provided. The solid-state imaging device includes an imaging area that includes arrayed pixels having photoelectric converting units and transistor elements; and a peripheral circuit, in which a wiring line in the imaging area that is shifted based on pupil correction amount and a wiring line in the peripheral circuit that is not shifted are connected through a connection expanded portion integrally formed with one or both of the wiring lines.
Public/Granted literature
- US20070273779A1 Solid-state imaging device, method of manufacturing the same and camera module Public/Granted day:2007-11-29
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