发明授权
- 专利标题： Composite wafers having bulk-quality semiconductor layers and method of manufacturing thereof
- 专利标题（中）： 具有散装质量半导体层的复合晶片及其制造方法
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申请号： US12018131申请日： 2008-01-22
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公开(公告)号： US07943485B2公开(公告)日： 2011-05-17
- 发明人: Daniel Francis , Felix Ejeckam , John Wasserbauer , Firooz Faili , Dubravko Babic
- 申请人： Daniel Francis , Felix Ejeckam , John Wasserbauer , Firooz Faili , Dubravko Babic
- 申请人地址： US CA Menlo Park
- 专利权人： Group4 Labs, LLC
- 当前专利权人： Group4 Labs, LLC
- 当前专利权人地址： US CA Menlo Park
- 代理机构： Pillsbury Winthrop Shaw Pittman LLP
- 代理商 David H. Jaffer
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/46
摘要：
Method for producing composite wafers with thin high-quality semiconductor films atomically attached to synthetic diamond wafers is disclosed. Synthetic diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited on bulk semiconductor wafer which has been prepared to allow separation of the thin semiconductor film from the remaining bulk semiconductor wafer. The remaining semiconductor wafer is available for reuse. The synthetic diamond substrate serves as heat spreader and a mechanical substrate.
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