Abstract:
A light detection module has N optical channels, each with an optical filter, a detector, and an amplifier; and an N×1 switch with N input ports each connected to one corresponding output port of each channel to receive an amplified detector output corresponding to a filtered optical intensity incident on that detector. The switch cycles between channels, connecting each amplified detector output in turn to the output port. An ADC samples a time dependent optical intensity signal from the switch, generating a corresponding ADC digital signal output. A microcontroller, connected to the N×1 switch and the ADC, controls acquisition by the ADC to provide a digital voltage data stream from each channel; making the average optical intensity value characterizing the voltage data stream available from each channel at a digital output port of the microcontroller, as N data values, characterizing the light incident on the N channels of the module.
Abstract:
A fiber-optic transmitter comprises a transmitter optical port, an optical circulator, a semiconductor optical amplifier, and a two-port modulation-averaging structure. The optical circulator has at least three ports, a first one of the three circulator ports being optically coupled to the transmitter optical port. The semiconductor optical amplifier has an input optical port, an output optical port, and an electrical input port. The two-port modulation-averaging structure is optically coupled between the input optical port and a third one of the three circulator ports.
Abstract:
A fiber-optic transmitter comprises a transmitter optical port, an optical circulator, a semiconductor optical amplifier, and a two-port modulation-averaging structure. The optical circulator has at least three ports, a first one of the three circulator ports being optically coupled to the transmitter optical port. The semiconductor optical amplifier has an input optical port, an output optical port, and an electrical input port. The two-port modulation-averaging structure is optically coupled between the input optical port and a third one of the three circulator ports.
Abstract:
Methods for integrating wide-gap semiconductors with synthetic diamond substrates are disclosed. Diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited or formed on a layered structure including at least one layer of gallium nitride, aluminum nitride, silicon carbide, or zinc oxide. The resulting structure is a low stress process compatible with wide-gap semiconductor films, and may be processed into optical or high-power electronic devices. The diamond substrates serve as heat sinks or mechanical substrates.
Abstract:
A communications adaptor card is disclosed herein. One embodiment of the communications adaptor card comprises, a printed-circuit board, the printed circuit board having at least one keep-out area, the at least one keep-out area configured to accept a multi-contact electrical connector receptacle and at least one optical module attached to the printed circuit board. The at least one optical module can be attached to the printed circuit board substantially within the at-least-one keep-out area.
Abstract:
Method for producing composite wafers with thin high-quality semiconductor films atomically attached to synthetic diamond wafers is disclosed. Synthetic diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited on bulk semiconductor wafer which has been prepared to allow separation of the thin semiconductor film from the remaining bulk semiconductor wafer. The remaining semiconductor wafer is available for reuse. The synthetic diamond substrate serves as heat spreader and a mechanical substrate.
Abstract:
This application discloses apparatuses and methods for selecting and tuning of a select mode of a multi-longitudinal mode device seeded or wavelength locked to a spectrum-sliced external wavelength by either self-seeding or broadband light-source seeding through an array-waveguide grating.
Abstract:
Methods for integrating wide-gap semiconductors with synthetic diamond substrates are disclosed. Diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited or formed on a layered structure including at least one layer of gallium nitride, aluminum nitride, silicon carbide, or zinc oxide. The resulting structure is a low stress process compatible with wide-gap semiconductor films, and may be processed into optical or high-power electronic devices. The diamond substrates serve as heat sinks or mechanical substrates.
Abstract:
Methods for integrating wide-gap semiconductors with synthetic diamond substrates are disclosed. Diamond substrates are created by depositing synthetic diamond onto a nucleating layer deposited or formed on a layered structure including at least one layer of gallium nitride, aluminum nitride, silicon carbide, or zinc oxide. The resulting structure is a low stress process compatible with wide-gap semiconductor films, and may be processed into optical or high-power electronic devices. The diamond substrates serve as heat sinks or mechanical substrates.
Abstract:
An array of n-wavelength vertical cavity surface emitting lasers (VCSELs) can be grown with precise and repeatable wavelength control. First, a foundation VCSEL structure is grown on a substrate. Next, n-paired layers of AlGaAs and InGaP are grown, where n is the desired number of different wavelengths. Next, one of the n regions is masked and etched. The steps of masking and etching are repeated until all n regions are etched. Finally, the upper VCSEL structure is grown.