发明授权
- 专利标题: Lateral SOI semiconductor devices and manufacturing method thereof
- 专利标题(中): 横向SOI半导体器件及其制造方法
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申请号: US12097811申请日: 2006-11-17
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公开(公告)号: US07943957B2公开(公告)日: 2011-05-17
- 发明人: Masato Taki , Masahiro Kawakami , Kiyoharu Hayakawa , Masayasu Ishiko
- 申请人: Masato Taki , Masahiro Kawakami , Kiyoharu Hayakawa , Masayasu Ishiko
- 申请人地址: JP Toyota-shi, Aichi-ken
- 专利权人: Toyota Jidosha Kabushiki Kaisha
- 当前专利权人: Toyota Jidosha Kabushiki Kaisha
- 当前专利权人地址: JP Toyota-shi, Aichi-ken
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- 优先权: JP2005-367417 20051221
- 国际申请: PCT/JP2006/323513 WO 20061117
- 国际公布: WO2007/072655 WO 20070628
- 主分类号: H01L29/861
- IPC分类号: H01L29/861
摘要:
A diode 10 comprises an SOI substrate in which are stacked a semiconductor substrate 20, an insulator film 30, and a semiconductor layer 40. A bottom semiconductor region 60, an intermediate semiconductor region 53, and a surface semiconductor region 54 are formed in the semiconductor layer 40. The bottom semiconductor region 60 includes a high concentration of n-type impurity. The intermediate semiconductor region 53 includes a low concentration of n-type impurity. The surface semiconductor region 54 includes p-type impurity.
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