发明授权
US07943957B2 Lateral SOI semiconductor devices and manufacturing method thereof 有权
横向SOI半导体器件及其制造方法

Lateral SOI semiconductor devices and manufacturing method thereof
摘要:
A diode 10 comprises an SOI substrate in which are stacked a semiconductor substrate 20, an insulator film 30, and a semiconductor layer 40. A bottom semiconductor region 60, an intermediate semiconductor region 53, and a surface semiconductor region 54 are formed in the semiconductor layer 40. The bottom semiconductor region 60 includes a high concentration of n-type impurity. The intermediate semiconductor region 53 includes a low concentration of n-type impurity. The surface semiconductor region 54 includes p-type impurity.
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