Invention Grant
US07947423B2 Photosensitive compound and photoresist composition including the same
失效
光敏化合物和包含其的光致抗蚀剂组合物
- Patent Title: Photosensitive compound and photoresist composition including the same
- Patent Title (中): 光敏化合物和包含其的光致抗蚀剂组合物
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Application No.: US12208586Application Date: 2008-09-11
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Publication No.: US07947423B2Publication Date: 2011-05-24
- Inventor: Jae-Woo Lee , Min-Ja Yoo , Jun-Gyeong Lee , Young-Bae Lim , Jae-Hyun Kim
- Applicant: Jae-Woo Lee , Min-Ja Yoo , Jun-Gyeong Lee , Young-Bae Lim , Jae-Hyun Kim
- Applicant Address: KR Incheon
- Assignee: Dongjin Semichem Co., Ltd.
- Current Assignee: Dongjin Semichem Co., Ltd.
- Current Assignee Address: KR Incheon
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2007-0093374 20070914
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30 ; G03F7/38 ; C07C43/205

Abstract:
A photosensitive compound whose size is smaller than conventional polymer for photoresist, and which has well-defined (uniform) structure, and a photoresist composition including the same are disclosed. The photosensitive compound represented by the following formula 1. Also, the photoresist composition comprises 1 to 85 wt % (weight %) of the photosensitive compound; 0.05 to 15 weight parts of a photo-acid generator with respect to 100 weight parts of the photosensitive compound; and 200 to 5000 weight parts of an organic solvent. In the formula 1, x is 1, 2, 3, 4 or 5, y is 2, 3, 4, 5 or 6, and R and R′ are independently a chain type or a ring type of aliphatic or aromatic hydrocarbon group of 1 to 30 carbon atoms.
Public/Granted literature
- US20090081587A1 PHOTOSENSITIVE COMPOUND AND PHOTORESIST COMPOSITION INCLUDING THE SAME Public/Granted day:2009-03-26
Information query
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