发明授权
US07948090B2 Capillary-flow underfill compositions, packages containing same, and systems containing same
有权
毛细管底部填充组合物，含有它们的包装和含有它们的体系
- 专利标题： Capillary-flow underfill compositions, packages containing same, and systems containing same
- 专利标题（中）： 毛细管底部填充组合物，含有它们的包装和含有它们的体系
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申请号： US11613805申请日： 2006-12-20
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公开(公告)号： US07948090B2公开(公告)日： 2011-05-24
- 发明人: Rahul N. Manepalli , Saikumar Jayaraman
- 申请人： Rahul N. Manepalli , Saikumar Jayaraman
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理商 John N. Greaves
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; B32B27/38 ; C08L61/00
摘要：
An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer and a hardener and allowing the underfill composition to flow between the integrated circuit die and the mounting substrate. An article is achieved by the method. The article can be assembled into a computing system.
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