Invention Grant
- Patent Title: Multilayered probe card
- Patent Title (中): 多层探针卡
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Application No.: US12173695Application Date: 2008-07-15
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Publication No.: US07948252B2Publication Date: 2011-05-24
- Inventor: Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
- Applicant: Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Kirton & McConkie
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
Public/Granted literature
- US20080272794A1 METHOD OF MANUFACTURING A PROBE CARD Public/Granted day:2008-11-06
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