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公开(公告)号：US07196531B2
公开(公告)日：2007-03-27
申请号：US11073187
申请日：2005-03-04
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Jim Chih-Chiang Tseng
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Jim Chih-Chiang Tseng
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
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公开(公告)号：US20080272794A1
公开(公告)日：2008-11-06
申请号：US12173695
申请日：2008-07-15
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R1/073
CPC分类号： G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , G01R31/2889 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49453
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译： 一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。 此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。 使用接收到的数据，选择一个或多个预制元素。 再次使用接收的数据，定制一个或多个所选择的预制元素。 然后使用选定和定制的元件构建探针卡组件。
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公开(公告)号：US07948252B2
公开(公告)日：2011-05-24
申请号：US12173695
申请日：2008-07-15
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R31/02
CPC分类号： G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , G01R31/2889 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49453
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译： 一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。 此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。 使用接收到的数据，选择一个或多个预制元素。 再次使用接收的数据，定制一个或多个所选择的预制元素。 然后使用选定和定制的元件构建探针卡组件。
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4.发明授权公开(公告)号：US07400157B2
公开(公告)日：2008-07-15
申请号：US11692035
申请日：2007-03-27
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译： 一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。 此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。 使用接收到的数据，选择一个或多个预制元素。 再次使用接收的数据，定制一个或多个所选择的预制元素。 然后使用选定和定制的元件构建探针卡组件。
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公开(公告)号：US06864105B2
公开(公告)日：2005-03-08
申请号：US10087081
申请日：2002-03-01
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
CPC分类号： G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , G01R31/2889 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49453
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译： 一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。 此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。 使用接收到的数据，选择一个或多个预制元素。 再次使用接收的数据，定制一个或多个所选择的预制元素。 然后使用选定和定制的元件构建探针卡组件。
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公开(公告)号：US20050146339A1
公开(公告)日：2005-07-07
申请号：US11073187
申请日：2005-03-04
申请人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
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公开(公告)号：US20070247176A1
公开(公告)日：2007-10-25
申请号：US11692035
申请日：2007-03-27
申请人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary Grube , Igor Khandros , Benjamin Eldridge , Gaetan Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
CPC分类号： G01R31/2886 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R3/00 , Y10T29/49126
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译： 一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。 此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。 使用接收到的数据，选择一个或多个预制元素。 再次使用接收的数据，定制一个或多个所选择的预制元素。 然后使用选定和定制的元件构建探针卡组件。
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