Invention Grant
- Patent Title: Trench semiconductor device and method of making the same
- Patent Title (中): 沟槽半导体器件及其制造方法
-
Application No.: US12477121Application Date: 2009-06-02
-
Publication No.: US07952137B2Publication Date: 2011-05-31
- Inventor: Wei-Chieh Lin , Li-Cheng Lin
- Applicant: Wei-Chieh Lin , Li-Cheng Lin
- Applicant Address: TW Hsinchu Science Park, Hsin-Chu
- Assignee: Anpec Electronics Corporation
- Current Assignee: Anpec Electronics Corporation
- Current Assignee Address: TW Hsinchu Science Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: TW98112026A 20090410
- Main IPC: H01L23/60
- IPC: H01L23/60

Abstract:
A trench semiconductor device and a method of making the same are provided. The trench semiconductor device includes a trench MOS device and a trench ESD protection device. The trench ESD protection device is electrically connected between the gate electrode and source electrode of the trench MOS device so as to provide ESD protection. The fabrication of the ESD protection device is integrated into the process of the trench MOS device, and therefore no extra mask is required to define the doped regions of the trench ESD protection device. Consequently, the trench semiconductor device is advantageous for its simplified manufacturing process and low cost.
Public/Granted literature
- US20100258853A1 TRENCH SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME Public/Granted day:2010-10-14
Information query
IPC分类: