发明授权
- 专利标题： Method of embedding passive component within via
- 专利标题（中）： 无源元件嵌入通孔的方法
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申请号： US11847985申请日： 2007-08-30
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公开(公告)号： US07952202B2公开(公告)日： 2011-05-31
- 发明人: Todd B Myers , Nicholas R. Watts , Eric C Palmer , Jui Min Lim
- 申请人： Todd B Myers , Nicholas R. Watts , Eric C Palmer , Jui Min Lim
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwegman, Lundberg & Woessner, P.A.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52
摘要：
A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.
公开/授权文献
- US20090057910A1 METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA 公开/授权日：2009-03-05
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