发明授权
- 专利标题: High density electrical interconnect assembly
- 专利标题(中): 高密度电气互连组件
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申请号: US11906227申请日: 2007-10-01
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公开(公告)号: US07952833B2公开(公告)日: 2011-05-31
- 发明人: Ralph Kevin Smith
- 申请人: Ralph Kevin Smith
- 申请人地址: US CA Scotts Valley
- 专利权人: Seagate Technology LLC
- 当前专利权人: Seagate Technology LLC
- 当前专利权人地址: US CA Scotts Valley
- 代理商 Jennifer M. Buenzow
- 主分类号: G11B5/48
- IPC分类号: G11B5/48
摘要:
An electrical connection assembly includes a body, an electrically insulative layer supported by the body, a first bond pad defined on the electrically insulative layer, a first electrical contact pad defined on the electrically insulative layer and electrically isolated from the first bond pad, a circuit located adjacent to the electrically insulative layer defining a second bond pad and a second electrical contact pad that are electrically isolated from each other, and an electrically conductive bonding material that electrically and mechanically links the first and second bond pads. After setting, the electrically conductive bonding material biases the first and second electrical contact pads against each other in order to create an electrical connection therebetween.
公开/授权文献
- US20090086374A1 High density electrical interconnect assembly 公开/授权日:2009-04-02
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