Leading edge bond pads
    1.
    发明授权
    Leading edge bond pads 有权
    前沿接合垫

    公开(公告)号:US06757135B2

    公开(公告)日:2004-06-29

    申请号:US09912996

    申请日:2001-07-25

    IPC分类号: G11B2121

    CPC分类号: G11B5/4826

    摘要: The invention is a suspension gimbal-head assembly that includes a magnetic head having a leading edge and a following edge, a suspension gimbal, the magnetic head is mechanically connected to the suspension gimbal at the head leading edge and the head following edge. There is also provided a disk drive that includes a suspension gimbal-head assembly that includes a magnetic head having a leading edge and a following edge, a suspension gimbal, the magnetic head mechanically connected to the suspension gimbal at the head leading edge and the head following edge.

    摘要翻译: 本发明是一种悬挂万向头组件,其包括具有前缘和后缘的磁头,悬架万向架,磁头在磁头前缘和磁头跟随边缘机械连接到悬架万向架。 还提供了一种磁盘驱动器,其包括悬架万向头组件,其包括具有前缘和后边缘的磁头,悬架万向架,磁头机械地连接到头前缘处的悬架万向架和头部 跟随边缘

    High density electrical interconnect assembly
    2.
    发明申请
    High density electrical interconnect assembly 有权
    高密度电气互连组件

    公开(公告)号:US20090086374A1

    公开(公告)日:2009-04-02

    申请号:US11906227

    申请日:2007-10-01

    申请人: Ralph Kevin Smith

    发明人: Ralph Kevin Smith

    IPC分类号: G11B5/60

    CPC分类号: G11B5/4826 G11B5/4853

    摘要: An electrical connection assembly includes a body, an electrically insulative layer supported by the body, a first bond pad defined on the electrically insulative layer, a first electrical contact pad defined on the electrically insulative layer and electrically isolated from the first bond pad, a circuit located adjacent to the electrically insulative layer defining a second bond pad and a second electrical contact pad that are electrically isolated from each other, and an electrically conductive bonding material that electrically and mechanically links the first and second bond pads. After setting, the electrically conductive bonding material biases the first and second electrical contact pads against each other in order to create an electrical connection therebetween.

    摘要翻译: 电连接组件包括主体,由主体支撑的电绝缘层,限定在电绝缘层上的第一接合焊盘,限定在电绝缘层上并与第一接合焊盘电隔离的第一电接触焊盘,电路 位于邻近所述电绝缘层的位置,所述电绝缘层限定彼此电隔离的第二接合焊盘和第二电接触焊盘,以及导电接合材料,其电和机械地连接所述第一和第二接合焊盘。 在设置之后,导电接合材料将第一和第二电接触垫彼此偏置以在它们之间形成电连接。

    High density electrical interconnect assembly
    3.
    发明授权
    High density electrical interconnect assembly 有权
    高密度电气互连组件

    公开(公告)号:US07952833B2

    公开(公告)日:2011-05-31

    申请号:US11906227

    申请日:2007-10-01

    申请人: Ralph Kevin Smith

    发明人: Ralph Kevin Smith

    IPC分类号: G11B5/48

    CPC分类号: G11B5/4826 G11B5/4853

    摘要: An electrical connection assembly includes a body, an electrically insulative layer supported by the body, a first bond pad defined on the electrically insulative layer, a first electrical contact pad defined on the electrically insulative layer and electrically isolated from the first bond pad, a circuit located adjacent to the electrically insulative layer defining a second bond pad and a second electrical contact pad that are electrically isolated from each other, and an electrically conductive bonding material that electrically and mechanically links the first and second bond pads. After setting, the electrically conductive bonding material biases the first and second electrical contact pads against each other in order to create an electrical connection therebetween.

    摘要翻译: 电连接组件包括主体,由主体支撑的电绝缘层,限定在电绝缘层上的第一接合焊盘,限定在电绝缘层上并与第一接合焊盘电隔离的第一电接触焊盘,电路 位于邻近所述电绝缘层的位置,所述电绝缘层限定彼此电隔离的第二接合焊盘和第二电接触焊盘,以及导电接合材料,其电和机械地连接所述第一和第二接合焊盘。 在设置之后,导电接合材料将第一和第二电接触垫彼此偏置以在它们之间形成电连接。