A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprises a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected with the substrate and a sensing region of the fingerprint sensor chip is exposed by a window of the dielectric layer. The metal plate is electrically connected with the substrate and a sliding surface of the metal plate is close to the sensing region of the fingerprint sensor chip. The sensing region and the sliding surface are exposed by the window of the dielectric layer. The sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, and a plurality of external contact pads on a circuit layer of the substrate are located at the conductive portion.