Invention Grant
US07955937B2 Method for manufacturing semiconductor device comprising SOI transistors and bulk transistors
有权
包括SOI晶体管和体晶体管的半导体器件的制造方法
- Patent Title: Method for manufacturing semiconductor device comprising SOI transistors and bulk transistors
- Patent Title (中): 包括SOI晶体管和体晶体管的半导体器件的制造方法
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Application No.: US11560896Application Date: 2006-11-17
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Publication No.: US07955937B2Publication Date: 2011-06-07
- Inventor: Karsten Wieczorek , Manfred Horstmann , Thomas Feudel , Thomas Heller
- Applicant: Karsten Wieczorek , Manfred Horstmann , Thomas Feudel , Thomas Heller
- Applicant Address: US TX Austin
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US TX Austin
- Agency: Williams, Morgan & Amerson, P.C.
- Priority: DE102006015076 20060331
- Main IPC: H01L21/331
- IPC: H01L21/331

Abstract:
By forming bulk-like transistors in sensitive RAM areas of otherwise SOI-based CMOS circuits, a significant savings in valuable chip area may be achieved since the RAM areas may be formed on the basis of a bulk transistor configuration, thereby eliminating hysteresis effects that may typically be taken into consideration by providing transistors of increased transistor width or by providing body ties. Hence, the benefit of high switching speed may be maintained in speed-critical circuitry, such as CPU cores, while at the same time the RAM circuit may be formed in a highly space-efficient manner.
Public/Granted literature
- US20070228377A1 SEMICONDUCTOR DEVICE COMPRISING SOI TRANSISTORS AND BULK TRANSISTORS AND A METHOD OF FORMING THE SAME Public/Granted day:2007-10-04
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