Invention Grant
US07955937B2 Method for manufacturing semiconductor device comprising SOI transistors and bulk transistors 有权
包括SOI晶体管和体晶体管的半导体器件的制造方法

Method for manufacturing semiconductor device comprising SOI transistors and bulk transistors
Abstract:
By forming bulk-like transistors in sensitive RAM areas of otherwise SOI-based CMOS circuits, a significant savings in valuable chip area may be achieved since the RAM areas may be formed on the basis of a bulk transistor configuration, thereby eliminating hysteresis effects that may typically be taken into consideration by providing transistors of increased transistor width or by providing body ties. Hence, the benefit of high switching speed may be maintained in speed-critical circuitry, such as CPU cores, while at the same time the RAM circuit may be formed in a highly space-efficient manner.
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