发明授权
- 专利标题: Electrical connection of a substrate within a vacuum device via electrically conductive epoxy/paste
- 专利标题(中): 通过导电环氧树脂/糊料将真空装置内的基板电连接
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申请号: US12170562申请日: 2008-07-10
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公开(公告)号: US07956521B2公开(公告)日: 2011-06-07
- 发明人: Benjamin Brown
- 申请人: Benjamin Brown
- 申请人地址: US DE Wilmington
- 专利权人: ITT Manufacturing Enterprises, Inc.
- 当前专利权人: ITT Manufacturing Enterprises, Inc.
- 当前专利权人地址: US DE Wilmington
- 代理机构: RatnerPrestia
- 主分类号: H01J43/00
- IPC分类号: H01J43/00
摘要:
An image intensifier includes a microchannel plate (MCP) having an output surface, and a ceramic substrate having an outer surface. The output surface of the MCP and the outer surface of the ceramic substrate are oriented facing each other. An imager is substantially buried within the ceramic substrate, and an input surface of the imager is exposed to receive electrons from the output surface of the MCP. The input surface of the imager and the outer surface of the ceramic substrate are oriented in substantially the same plane. The input surface of the imager and the outer surface of the ceramic substrate are disposed at a very close distance from the output surface of the MCP. The imager includes input/output pads, and the ceramic substrate includes input/output pads. A conductive epoxy connects a respective input/output pad of the imager to a respective input/output pad of the ceramic substrate.
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