Invention Grant
US07959984B2 Methods and arrangement for the reduction of byproduct deposition in a plasma processing system
有权
在等离子体处理系统中减少副产物沉积的方法和装置
- Patent Title: Methods and arrangement for the reduction of byproduct deposition in a plasma processing system
- Patent Title (中): 在等离子体处理系统中减少副产物沉积的方法和装置
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Application No.: US11022982Application Date: 2004-12-22
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Publication No.: US07959984B2Publication Date: 2011-06-14
- Inventor: Shrikant P. Lohokare , Andrew D. Bailey, III
- Applicant: Shrikant P. Lohokare , Andrew D. Bailey, III
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: IP Strategy Group, P.C.
- Main IPC: H05H1/24
- IPC: H05H1/24
Abstract:
In a plasma processing system, a method of reducing byproduct deposits on a set of plasma chamber surfaces of a plasma processing chamber is disclosed. The method includes providing a deposition barrier in the plasma processing chamber, the deposition barrier is configured to be disposed in a plasma generating region of the plasma processing chamber, thereby permitting at least some process byproducts produced when a plasma is struck within the plasma processing chamber to adhere to the deposition barrier and reducing the byproduct deposits on the set of plasma processing chamber surfaces.
Public/Granted literature
- US20060130758A1 Methods and arrangement for the reduction of byproduct deposition in a plasma processing system Public/Granted day:2006-06-22
Information query
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