发明授权
- 专利标题： Chip package
- 专利标题（中）： 芯片封装
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申请号： US12169132申请日： 2008-07-08
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公开(公告)号： US07960214B2公开(公告)日： 2011-06-14
- 发明人: Geng-Shin Shen , David Wei Wang
- 申请人： Geng-Shin Shen , David Wei Wang
- 申请人地址： TW Hsinchu BM Hamilton
- 专利权人： ChipMOS Technologies Inc.,ChipMOS Technologies (Bermuda) Ltd.
- 当前专利权人： ChipMOS Technologies Inc.,ChipMOS Technologies (Bermuda) Ltd.
- 当前专利权人地址： TW Hsinchu BM Hamilton
- 代理机构： J.C. Patents
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A fabricating process of chip package structure is provided. First, a first substrate having a plurality of first bonding pads and a second substrate having a plurality of second bonding pads are provide, wherein a plurality of bumps are formed on the first bonding pads of the first substrate. A first two-stage adhesive layer is formed on the first substrate or on the second substrate and is B-stagized to form a first B-staged adhesive layer. A second two-stage adhesive layer is formed on the first B-staged adhesive layer and is B-stagized to form a second B-staged adhesive layer. Then, the first substrate and the second substrate are bonded via the first B-staged adhesive layer and the second B-staged adhesive layer such that each of the first bonding pads is respectively electrically connected to one of the second bonding pads via one of the bumps.
公开/授权文献
- US20080268572A1 CHIP PACKAGE 公开/授权日：2008-10-30
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