Invention Grant
- Patent Title: Silicon-based thin-film photoelectric converter and method of manufacturing the same
- Patent Title (中): 硅基薄膜光电转换器及其制造方法
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Application No.: US11991141Application Date: 2006-07-25
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Publication No.: US07960646B2Publication Date: 2011-06-14
- Inventor: Toshiaki Sasaki , Kenji Yamamoto
- Applicant: Toshiaki Sasaki , Kenji Yamamoto
- Applicant Address: JP Osaka-shi
- Assignee: Kaneka Corporation
- Current Assignee: Kaneka Corporation
- Current Assignee Address: JP Osaka-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2005-249551 20050830
- International Application: PCT/JP2006/314605 WO 20060725
- International Announcement: WO2007/026480 WO 20070308
- Main IPC: H01L31/00
- IPC: H01L31/00 ; B05D5/12

Abstract:
In order to improve photoelectric conversion properties of a silicon-based thin-film photoelectric converter to which a conductive SiOx layer is inserted to obtain an optical confinement effect, the silicon-based thin-film photoelectric converter according to the present invention includes an i-type photoelectric conversion layer of hydrogenated amorphous silicon or an alloy thereof, an i-type buffer layer made of hydrogenated amorphous silicon, and an n-type Si1-xOx layer (x is 0.25-0.6) stacked successively, wherein the buffer layer has a higher hydrogen concentration at its interface with and as compared with the photoelectric conversion layer and has a thickness of at least 5 nm and at most 50 nm. Accordingly, generation of silicon crystal phase parts and reduction of resistivity are promoted in the n-type Si1-xOx layer, contact resistance at the interface is reduced, and FF of the photoelectric converter is improved, so that the photoelectric converter achieves improved properties.
Public/Granted literature
- US20090133753A1 Silicon-based thin-film photoeclectric converter and method of manufacturing the same Public/Granted day:2009-05-28
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