An electrical connector for electrically coupling an electronic module and an electrical component. The connector includes a connector body that has first and second mating surfaces. The connector body includes interconnects that extend through the connector body between the first and second mating surfaces for electrically coupling the module and the component. The connector body has a hole extending therethrough along a central axis. The hole is configured to receive a guide pin from one of the module and the component. The connector also includes surface mount projections that are coupled to the connector body and extend toward the central axis of the hole. The projections engage and flex against the guide pin when the guide pin is inserted into the hole. The projections form an interference fit with the guide pin to hold the connector body in a mounted position.