Invention Grant
- Patent Title: Multi-port pumping system for substrate processing chambers
- Patent Title (中): 用于基板处理室的多端口抽吸系统
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Application No.: US12265641Application Date: 2008-11-05
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Publication No.: US07964040B2Publication Date: 2011-06-21
- Inventor: Muhammad M. Rasheed , Dmitry Lubomirsky , James Santosa
- Applicant: Muhammad M. Rasheed , Dmitry Lubomirsky , James Santosa
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: B08B5/00
- IPC: B08B5/00

Abstract:
An exhaust foreline for purging fluids from a semiconductor fabrication chamber is described. The foreline may include a first, second and third ports independently coupled to the chamber. A semiconductor fabrication system is also described that includes a substrate chamber that has a first, second and third interface port. The system may also include a multi-port foreline that has a first, second and third port, where the first foreline port is coupled to the first interface port, the second foreline port is coupled to the second interface port, and the third foreline port is coupled to the third interface port. The system may further include an exhaust vacuum coupled to the multi-port foreline.
Public/Granted literature
- US20090120464A1 MULTI-PORT PUMPING SYSTEM FOR SUBSTRATE PROCESSING CHAMBERS Public/Granted day:2009-05-14
Information query
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