Invention Grant
US07964336B2 Metal or metal compound pattern and forming method of pattern, and electron emitting device, electron source, and image-forming apparatus using the pattern
失效
金属或金属化合物图案和图案形成方法,以及使用该图案的电子发射器件,电子源和图像形成装置
- Patent Title: Metal or metal compound pattern and forming method of pattern, and electron emitting device, electron source, and image-forming apparatus using the pattern
- Patent Title (中): 金属或金属化合物图案和图案形成方法,以及使用该图案的电子发射器件,电子源和图像形成装置
-
Application No.: US12409569Application Date: 2009-03-24
-
Publication No.: US07964336B2Publication Date: 2011-06-21
- Inventor: Tsuyoshi Furuse , Masahiro Terada , Shosei Mori
- Applicant: Tsuyoshi Furuse , Masahiro Terada , Shosei Mori
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2001-121193 20010419; JP2002-108791 20020411
- Main IPC: G03F7/26
- IPC: G03F7/26
![Metal or metal compound pattern and forming method of pattern, and electron emitting device, electron source, and image-forming apparatus using the pattern](/abs-image/US/2011/06/21/US07964336B2/abs.jpg.150x150.jpg)
Abstract:
The present invention is to provide a method for forming various patterns such as a metal or metal compound pattern, in which the amounts of the materials constituting the pattern which are removed during the formation step can be suppressed to the minimum. The method comprises a resin pattern forming step of forming on the surface of a substrate a resin pattern capable of absorbing a solution containing metal components, an absorbing step of dipping the resin pattern in the solution containing metal components to make the resin pattern absorb the solution containing metal components, a washing step of washing the substrate having formed thereon the resin pattern that has absorbed the solution containing metal components, and a burning step of burning the resin pattern after washing.
Public/Granted literature
Information query
IPC分类: