Invention Grant
- Patent Title: Electroless plating apparatus with non-liquid heating source
- Patent Title (中): 具有非液体加热源的无电镀设备
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Application No.: US11796201Application Date: 2007-04-27
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Publication No.: US07966968B2Publication Date: 2011-06-28
- Inventor: Cheng Hsun Chan , Chien Ling Hwang
- Applicant: Cheng Hsun Chan , Chien Ling Hwang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: B05B13/02
- IPC: B05B13/02 ; B05C11/02
Abstract:
An electroless plating apparatus is provided. The electroless plating apparatus includes a wafer holder; a chemical dispensing nozzle over the wafer holder; a conduit connected to the chemical dispensing nozzle; and a radiation source over the wafer holder.
Public/Granted literature
- US20080268553A1 Electroless plating apparatus with non-liquid heating source Public/Granted day:2008-10-30
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