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6 条记录 (耗时 0.017 秒)

    Image sensor system for monitoring condition of electrode for electrochemical process tools
    3.
    发明授权
    Image sensor system for monitoring condition of electrode for electrochemical process tools 有权
    用于电化学处理工具电极监测状态的图像传感器系统

    公开(公告)号：US07416648B2

    公开(公告)日：2008-08-26

    申请号：US11127361

    申请日：2005-05-12

    申请人： Wen-Chih Chiou ,  Ying-Ho Chen ,  Cheng Hsun Chan

    发明人： Wen-Chih Chiou ,  Ying-Ho Chen ,  Cheng Hsun Chan

    IPC分类号： C25B9/02

    CPC分类号： B24B37/04 ,  B23H5/08 ,  B24B49/12 ,  H01L21/67288

    摘要： A system for use in manufacturing semiconductor devices, is provided. The system includes an electrochemical processing tool and an image sensor. The electrochemical processing tool includes an electrode located at a central region of a platen. The electrode is adapted for contacting a wafer workpiece during certain processing of the wafer workpiece using the tool. At least part of the electrode is viewable from above the platen when the electrochemical processing tool is operably assembled. The image sensor is capable of capturing an image of the viewable part of the electrode. The image sensor is positioned above the platen. The image sensor is adapted to be aimed at the electrode when an image of the electrode is to be taken with the image sensor.

    摘要翻译： 提供一种用于制造半导体器件的系统。 该系统包括电化学处理工具和图像传感器。 电化学处理工具包括位于压板的中心区域的电极。 电极适于在使用该工具的晶片工件的某些处理期间接触晶片工件。 当电化学加工工具可操作地组装时，电极的至少部分可从压板上方观察。 图像传感器能够捕获电极的可视部分的图像。 图像传感器位于压板上方。 当用图像传感器拍摄电极的图像时，图像传感器适于瞄准电极。

    Rinsing Wafers Using Composition-Tunable Rinse Water in Chemical Mechanical Polish
    5.
    发明申请
    Rinsing Wafers Using Composition-Tunable Rinse Water in Chemical Mechanical Polish 有权
    在化学机械抛光中使用组合物可调冲洗水冲洗晶片

    公开(公告)号：US20100018029A1

    公开(公告)日：2010-01-28

    申请号：US12179347

    申请日：2008-07-24

    申请人： Cheng Hsun Chan ,  Ming-Che Ho

    发明人： Cheng Hsun Chan ,  Ming-Che Ho

    IPC分类号： B23P17/00

    CPC分类号： H01L21/67046 ,  H01L21/67051 ,  Y10T29/49002

    摘要： An apparatus for manufacturing integrated circuits on a wafer includes a polish pad; a rinse arm movable over the polish pad; and a post-polish cleaner. The post-polish cleaner includes a brush for brushing the wafer; and a nozzle aiming at the wafer. The apparatus further includes a mixer configured to mix an additive and di-ionized water; and a pipe connecting the mixer to at least one of the rinse arm and the nozzle.

    摘要翻译： 用于在晶片上制造集成电路的装置包括抛光垫; 漂洗臂可移动在抛光垫上; 和一个后抛光清洁剂。 后抛光清洁器包括用于刷洗晶片的刷子; 以及瞄准晶片的喷嘴。 该装置还包括配置成混合添加剂和二次电离水的混合器; 以及将混合器连接到冲洗臂和喷嘴中的至少一个的管道。

    CMP system with temperature-controlled polishing head
    6.
    发明授权
    CMP system with temperature-controlled polishing head 有权
    CMP系统带有温度控制的抛光头

    公开(公告)号：US07335088B1

    公开(公告)日：2008-02-26

    申请号：US11653615

    申请日：2007-01-16

    申请人： Jerry Hwang ,  Cheng Hsun Chan

    发明人： Jerry Hwang ,  Cheng Hsun Chan

    IPC分类号： B24B51/00 ,  B24B1/00 ,  B24B5/00

    CPC分类号： B24B37/30 ,  B24B41/061 ,  B24B49/14

    摘要： A chemical mechanical polish system for polishing a wafer includes a polishing head; an inner tube connected to the polishing head, wherein the inner tube is filled with a heat media; a media heater connected to the inner tube; and a pressure controller connected to the inner tube.

    摘要翻译： 用于抛光晶片的化学机械抛光系统包括抛光头; 连接到抛光头的内管，其中内管填充有热介质; 连接到内管的介质加热器; 以及连接到内管的压力控制器。