Invention Grant
US07969024B2 Semiconductor package with joint reliability, entangled wires including insulating material 失效
半导体封装具有接头可靠性,缠绕电线包括绝缘材料

Semiconductor package with joint reliability, entangled wires including insulating material
Abstract:
A semiconductor package with improved joint reliability and a method of fabricating the semiconductor package are disclosed. A conductive connector may be formed on a surface of a semiconductor wafer on which semiconductor devices may be arranged. A first insulating layer including a first opening through which a portion of the connection pad is exposed may be formed on the connection pad and the semiconductor wafer. A rewiring line electrically connected to an exposed portion of the connection pad may be formed on the first insulating layer. A second insulating layer including a second opening through which a portion of the rewiring line is exposed may be formed on the rewiring line and the first insulating layer. A connection terminal including one or more entangled wires may be formed on an exposed portion of the rewiring line so as to be electrically connected to the rewiring line.
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