Invention Grant
US07969024B2 Semiconductor package with joint reliability, entangled wires including insulating material
失效
半导体封装具有接头可靠性,缠绕电线包括绝缘材料
- Patent Title: Semiconductor package with joint reliability, entangled wires including insulating material
- Patent Title (中): 半导体封装具有接头可靠性,缠绕电线包括绝缘材料
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Application No.: US12453103Application Date: 2009-04-29
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Publication No.: US07969024B2Publication Date: 2011-06-28
- Inventor: Hyun-soo Chung , Jae-shin Cho , Seong-deok Hwang , Jum-gon Kim , Ki-hyuk Kim
- Applicant: Hyun-soo Chung , Jae-shin Cho , Seong-deok Hwang , Jum-gon Kim , Ki-hyuk Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, PLC
- Priority: KR1020080059780 20080624
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52

Abstract:
A semiconductor package with improved joint reliability and a method of fabricating the semiconductor package are disclosed. A conductive connector may be formed on a surface of a semiconductor wafer on which semiconductor devices may be arranged. A first insulating layer including a first opening through which a portion of the connection pad is exposed may be formed on the connection pad and the semiconductor wafer. A rewiring line electrically connected to an exposed portion of the connection pad may be formed on the first insulating layer. A second insulating layer including a second opening through which a portion of the rewiring line is exposed may be formed on the rewiring line and the first insulating layer. A connection terminal including one or more entangled wires may be formed on an exposed portion of the rewiring line so as to be electrically connected to the rewiring line.
Public/Granted literature
- US20090315177A1 Semiconductor package with joint reliability Public/Granted day:2009-12-24
Information query
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