发明授权
- 专利标题： Polishing apparatus and polishing method
- 专利标题（中）： 抛光设备和抛光方法
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申请号： US12213186申请日： 2008-06-16
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公开(公告)号： US07976361B2公开(公告)日： 2011-07-12
- 发明人: Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
- 申请人： Tamami Takahashi , Masaya Seki , Hiroaki Kusa , Kenya Ito
- 申请人地址： JP Tokyo
- 专利权人： Ebara Corporation
- 当前专利权人： Ebara Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2007-171959 20070629
- 主分类号： B24B1/00
- IPC分类号： B24B1/00
摘要：
A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.
公开/授权文献
- US20090004952A1 Polishing apparatus and polishing method 公开/授权日：2009-01-01
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