公开(公告)号：US08506362B2

公开(公告)日：2013-08-13

申请号：US12667891

申请日：2008-07-08

申请人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

发明人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B7/26

CPC分类号： B24B21/002 ,  B24B9/065 ,  H01L21/02021

摘要： A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.

摘要翻译： 抛光装置包括：基板保持器，其构造成保持和旋转基板;压垫，其构造成将具有抛光表面的抛光带压靠在由基板保持器保持的基板的斜面部分上;以及馈送机构，其构造成使抛光 胶带沿其纵向行进。 压垫包括具有用于通过研磨带挤压基板的斜面部分的按压表面的硬质部件和用于通过带状抛光工具将硬质部件压靠在基板的斜面部分上的至少一个弹性部件。

公开(公告)号：US07976361B2

公开(公告)日：2011-07-12

申请号：US12213186

申请日：2008-06-16

申请人： Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa ,  Kenya Ito

发明人： Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa ,  Kenya Ito

IPC分类号： B24B1/00

CPC分类号： B24B21/002 ,  B24B9/065 ,  H01L21/68707 ,  H01L21/68792

摘要： A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.

摘要翻译： 抛光装置适用于抛光半导体晶片等基板的周边。 抛光装置包括：保持部，其构造成保持工件;以及抛光头，其被配置为使研磨带与工件接触。 抛光装置还包括供给卷轴，其构造成将抛光带供给到抛光头，构造成重绕与工件接触的研磨带的倒带卷轴和摆动机构，其构造成使抛光头与第一抛光头进行摆动运动， 其枢轴在预定点。

公开(公告)号：US20090325465A1

公开(公告)日：2009-12-31

申请号：US12310364

申请日：2007-10-02

申请人： Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

发明人： Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B49/12 ,  B24B21/18 ,  B24B9/08

CPC分类号： B24B21/20 ,  B24B21/004 ,  B24B21/04

摘要： The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44). The polishing-tape supply and recovery mechanism (45) includes a motor Mb adapted to apply a torque to the polishing-tape supply reel (46) so as to exert a predetermined tension on the polishing tape (43) traveling through the polishing head (44), and a rotation angle detector REa adapted to detect a rotation angle of the polishing-tape supply reel (46).

摘要翻译： 本发明提供一种抛光装置和抛光方法，其能够计算研磨带供给卷轴和抛光带回收卷轴上的研磨带的辊的外径，并且能够计算研磨带的剩余量和消耗量 的研磨带的外径。 该抛光装置包括：抛光带供给卷轴（46），研磨头（44），研磨带引出机构G1和被配置为回收研磨带的研磨带供给和恢复机构（45） 43）从研磨带供给卷轴（46）经由研磨头（44）。 抛光带供给和恢复机构（45）包括电动机Mb，该电动机Mb适于向抛光带供给卷轴（46）施加扭矩，以便在穿过抛光头（3）的抛光带（43）上施加预定的张力 44）和适于检测研磨带供给卷轴（46）的旋转角度的旋转角度检测器REa。

公开(公告)号：US08047896B2

公开(公告)日：2011-11-01

申请号：US12310364

申请日：2007-10-02

申请人： Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

发明人： Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B49/00 ,  B24B21/20

CPC分类号： B24B21/20 ,  B24B21/004 ,  B24B21/04

摘要： The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44). The polishing-tape supply and recovery mechanism (45) includes a motor Mb adapted to apply a torque to the polishing-tape supply reel (46) so as to exert a predetermined tension on the polishing tape (43) traveling through the polishing head (44), and a rotation angle detector REa adapted to detect a rotation angle of the polishing-tape supply reel (46).

摘要翻译： 本发明提供一种抛光装置和抛光方法，其能够计算研磨带供给卷轴和抛光带回收卷轴上的研磨带的辊的外径，并且能够计算研磨带的剩余量和消耗量 的研磨带的外径。 该抛光装置包括：抛光带供给卷轴（46），研磨头（44），研磨带引出机构G1和被配置为回收研磨带的研磨带供给和恢复机构（45） 43）从研磨带供给卷轴（46）经由研磨头（44）。 抛光带供给和恢复机构（45）包括电动机Mb，该电动机Mb适于向抛光带供给卷轴（46）施加转矩，以便在穿过抛光头（3）的抛光带（43）上施加预定的张力 44）和适于检测研磨带供给卷轴（46）的旋转角度的旋转角度检测器REa。

公开(公告)号：US20090004952A1

公开(公告)日：2009-01-01

申请号：US12213186

申请日：2008-06-16

申请人： Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa ,  Kenya Ito

发明人： Tamami Takahashi ,  Masaya Seki ,  Hiroaki Kusa ,  Kenya Ito

IPC分类号： B24B21/02 ,  B24B21/22

CPC分类号： B24B21/002 ,  B24B9/065 ,  H01L21/68707 ,  H01L21/68792

摘要： A polishing apparatus according to the present invention is suitable for use in polishing a periphery of a substrate such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold the workpiece, a polishing head configured to bring the polishing tape into contact with the workpiece, a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot lying on a predetermined point.

摘要翻译： 根据本发明的抛光装置适用于抛光半导体晶片等基板的周边。 抛光装置包括：保持部，其构造成保持工件;抛光头，被配置为使抛光带与工件接触;供给卷轴，其构造成将抛光带供给到抛光头;构造成倒带抛光的回卷卷轴 已经接触到工件的胶带和摆动机构，其构造成使得抛光头在其枢轴位于预定点上时进行摆动运动。

公开(公告)号：US20110003540A1

公开(公告)日：2011-01-06

申请号：US12667901

申请日：2008-07-08

申请人： Tamami Takahashi ,  Kenya Ito ,  Hiroaki Kusa ,  Masaya Seki

发明人： Tamami Takahashi ,  Kenya Ito ,  Hiroaki Kusa ,  Masaya Seki

IPC分类号： B24B21/16 ,  B24B21/22

CPC分类号： B24B21/002 ,  B24B9/065 ,  H01L21/02021

摘要： A polishing apparatus according to the present invention includes a polishing tape (41) having a polishing surface, a substrate holder configured to hold and rotate a substrate (W), a press pad (50) configured to press the polishing tape against a bevel portion of the substrate held by the substrate holder, and a polishing-tape feeding mechanism (45) configured to cause the polishing tape to travel in its longitudinal direction. The press pad (50) includes a pad body (53), a plate-shaped pressing section having a pressing surface (51a) for pressing the bevel portion of the substrate through the polishing tape and having a rear surface (51b) opposite to the pressing surface, and a plurality of coupling sections (52) coupling the pressing section to the pad body. A space (S) is formed between the rear surface of the pressing section and the pad body.

摘要翻译： 根据本发明的抛光装置包括具有抛光表面的抛光带（41），用于保持和旋转基板（W）的基板保持器，压垫（50），其被配置为将研磨带压靠在斜面部分 由所述基板保持器保持的基板和被配置为使所述研磨带沿其长度方向行进的研磨带进给机构（45）。 压垫（50）包括垫体（53），板状按压部分，其具有用于通过研磨带挤压基板的斜面部分并具有与基板相对的后表面（51b）的按压表面（51a） 按压表面以及将按压部分连接到衬垫本体的多个联接部分（52）。 在按压部分的后表面和垫体之间形成空间（S）。

公开(公告)号：US20110003537A1

公开(公告)日：2011-01-06

申请号：US12667891

申请日：2008-07-08

申请人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

发明人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B21/16 ,  B24B21/22

CPC分类号： B24B21/002 ,  B24B9/065 ,  H01L21/02021

摘要： A polishing apparatus according to the present invention includes a substrate holder (32) configured to hold and rotate a substrate (W), a press pad (50) configured to press a polishing tape (41) having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism (45) configured to cause the polishing tape to travel in its longitudinal direction. The press pad (50) includes a hard member (51) having a pressing surface (51a) for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member (53) for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.

摘要翻译： 根据本发明的抛光装置包括：衬底保持器（32），其被构造成保持和旋转衬底（W），压垫（50）被构造成将具有抛光表面的抛光带（41）压靠在衬底 由基板保持器保持的基板和构造成使研磨带沿其纵向方向行进的进给机构（45）。 压垫（50）包括具有用于通过研磨带挤压基板的斜面部分的按压表面（51a）的硬质构件（51）和用于将硬构件压靠在斜面上的至少一个弹性构件（53） 通过带状抛光工具的基底部分。

公开(公告)号：US20080200100A1

公开(公告)日：2008-08-21

申请号：US11630512

申请日：2006-04-18

申请人： Tamami Takahashi ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki

发明人： Tamami Takahashi ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki

IPC分类号： B24B9/06 ,  H01L21/304 ,  B24B49/12

CPC分类号： H01L21/67219 ,  B24B9/065 ,  B24B49/04 ,  H01L21/302 ,  H01L21/461 ,  H01L21/67253 ,  H01L21/68707 ,  H01L21/68728

摘要： A substrate processing apparatus (1) includes first and second polishing units (70A, 70B) for polishing a peripheral portion of a substrate (W), a primary cleaning unit (100) for cleaning the substrate (W), a secondary cleaning and drying unit (110) for drying the substrate (W) cleaned in the primary cleaning unit (100), and a measurement unit (30) for measuring the peripheral portion of the substrate (W). The measurement unit (30) includes a mechanism for measurement required for polishing in the first and second polishing units (70A and 70B), such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.

摘要翻译： 一种基板处理装置（1）包括：用于研磨基板周边部分的第一和第二研磨单元（70A，70B）;用于清洗基板（W）的主清洁单元（100），二次清洗 以及用于干燥在主清洗单元（100）中清洁的基板（W）的干燥单元（110），以及用于测量基板（W）的周边部分的测量单元（30）。 测量单元（30）包括用于在第一和第二研磨单元（70A和70B）中抛光所需的测量机构，例如直径测量机构，横截面形状测量机构或表面状态测量机构 。

公开(公告)号：US20110165825A1

公开(公告)日：2011-07-07

申请号：US12673294

申请日：2008-07-23

申请人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

发明人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

IPC分类号： B24B9/00

CPC分类号： B24B9/065

摘要： A polishing apparatus according to the present invention is a polishing apparatus for polishing a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate (W) by bringing a polishing tool (41) into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder (20) configured to hold the substrate (W); and a polishing head (42) configured to polish the periphery of the substrate (W) held by the substrate holder (20) using the polishing tool (41). The polishing head (42) includes a press pad (50) for pressing the polishing tool (41) against the periphery of the substrate (W), and a linear motor (90) configured to reciprocate the press pad (50).

摘要翻译： 根据本发明的研磨装置是通过使研磨工具（41）与所述基板（W）滑动接触来研磨基板（W）的周边（斜面部，切口部，边缘切断部）的研磨装置 衬底周边。 抛光装置包括：基板保持架（20），其构造成保持基板（W）; 以及抛光头（42），其被配置为使用所述抛光工具（41）抛光由所述基板保持器（20）保持的所述基板（W）的周边。 抛光头（42）包括用于将抛光工具（41）压靠在基板（W）的周边上的压垫（50）和构造成使压垫（50）往复运动的直线电动机（90）。

公开(公告)号：US20090017733A1

公开(公告)日：2009-01-15

申请号：US11629463

申请日：2006-04-18

申请人： Tamami Takahashi ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki

发明人： Tamami Takahashi ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki

IPC分类号： B24B9/00

CPC分类号： B24B21/16 ,  B24B9/065 ,  H01L21/67046 ,  H01L21/67092 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/67766 ,  H01L21/68707 ,  H01L21/68728 ,  H01L21/68792

摘要： A substrate processing apparatus (1) has a first polishing unit (400A) and a second polishing unit (400B) for polishing a peripheral portion of a substrate. Each of the two polishing units (400A, 400B) includes a bevel polishing device (450A, 450B) for polishing a peripheral portion of a substrate and a notch polishing device (480A, 480B) for polishing a notch of a substrate. The substrate processing apparatus (1) has a maintenance space (7) formed between the two polishing units (400A, 400B). The bevel polishing devices (450A, 450B) in the two polishing units (400A, 400B) face the maintenance space (7) so as to be accessible from the maintenance space (7).

摘要翻译： 基板处理装置（1）具有用于研磨基板周边部分的第一研磨单元（400A）和第二研磨单元（400B）。 两个抛光单元（400A，400B）中的每一个包括用于抛光基板的周边部分的斜面抛光装置（450A，450B）和用于抛光基板的凹口的凹口抛光装置（480A，480B）。 基板处理装置（1）具有形成在两个研磨单元（400A，400B）之间的维护空间（7）。 两个抛光单元（400A，400B）中的斜面抛光装置（450A，450B）面向维护空间（7），以便从维护空间（7）进入。