Invention Grant
US07977254B2 Method of forming a gate insulator in group III-V nitride semiconductor devices
有权
在III-V族氮化物半导体器件中形成栅极绝缘体的方法
- Patent Title: Method of forming a gate insulator in group III-V nitride semiconductor devices
- Patent Title (中): 在III-V族氮化物半导体器件中形成栅极绝缘体的方法
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Application No.: US12931361Application Date: 2007-06-27
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Publication No.: US07977254B2Publication Date: 2011-07-12
- Inventor: Lung-Han Peng , Han-Ming Wu , Jing-Yi Lin
- Applicant: Lung-Han Peng , Han-Ming Wu , Jing-Yi Lin
- Applicant Address: TW Nantou
- Assignee: Tekcore Co., Ltd.
- Current Assignee: Tekcore Co., Ltd.
- Current Assignee Address: TW Nantou
- Agency: Baker & McKenzie LLP
- Agent David I. Roche
- Main IPC: H01L21/31
- IPC: H01L21/31

Abstract:
A method of forming a gate insulator in the manufacture of a semiconductor device comprises conducting a photo-assisted electrochemical process to form a gate-insulating layer on a gallium nitride layer of the semiconductor device, wherein the gate-insulating layer includes gallium oxynitride and gallium oxide, and performing a rapid thermal annealing process. The photo-assisted electrochemical process uses an electrolyte bath including buffered CH3COOH at a pH between about 5.5 and 7.5. The rapid thermal annealing process is conducted in O2 environment at a temperature between about 500° C. and 800° C.
Public/Granted literature
- US20110124203A1 Method of forming a gate insulator in group III-V nitride semiconductor devices Public/Granted day:2011-05-26
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