Invention Grant
- Patent Title: Hybrid metal fully silicided (FUSI) gate
- Patent Title (中): 混合金属全硅化(FUSI)门
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Application No.: US12777937Application Date: 2010-05-11
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Publication No.: US07977772B2Publication Date: 2011-07-12
- Inventor: Chen-Hua Yu , Cheng-Tung Lin , Cheng-Hung Chang , Hsiang-Yi Wang , Chen-Nan Yeh
- Applicant: Chen-Hua Yu , Cheng-Tung Lin , Cheng-Hung Chang , Hsiang-Yi Wang , Chen-Nan Yeh
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/4763
- IPC: H01L21/4763

Abstract:
A semiconductor device and system for a hybrid metal fully silicided (FUSI) gate structure is disclosed. The semiconductor system comprises a PMOS gate structure, the PMOS gate structure including a first high-κ dielectric layer, a P-metal layer, a mid-gap metal layer, wherein the mid-gap metal layer is formed between the high-κ dielectric layer, the P-metal layer and a fully silicided layer formed on the P-metal layer. The semiconductor system further comprises an NMOS gate structure, the NMOS gate structure includes a second high-κ dielectric layer, the fully silicided layer, and the mid-gap metal layer, wherein the mid-gap metal layer is formed between the high-κ dielectric and the fully silicided layer.
Public/Granted literature
- US20100221878A1 Hybrid Metal Fully Silicided (FUSI) Gate Public/Granted day:2010-09-02
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