发明授权
- 专利标题： Apparatus and methods for through substrate via test
- 专利标题（中）： 通过基板测试的装置和方法
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申请号： US12173722申请日： 2008-07-15
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公开(公告)号： US07977962B2公开(公告)日： 2011-07-12
- 发明人: Ebrahim H Hargan , Layne Bunker , Dragos Dimitriu , Gregory King
- 申请人： Ebrahim H Hargan , Layne Bunker , Dragos Dimitriu , Gregory King
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理机构： Schwegman, Lundberg & Woessner, P.A.
- 主分类号： G01R31/26
- IPC分类号： G01R31/26
摘要：
A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed.
公开/授权文献
- US20100013512A1 APPARATUS AND METHODS FOR THROUGH SUBSTRATE VIA TEST 公开/授权日：2010-01-21
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