发明授权
- 专利标题： Composition for surface modification of a heat sink and method for surface treatment of the heat sink for printed circuit boards using the same
- 专利标题（中）： 用于散热器表面改性的组合物和使用其的印刷电路板的散热器的表面处理方法
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申请号： US12235034申请日： 2008-09-22
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公开(公告)号： US07981317B2公开(公告)日： 2011-07-19
- 发明人: Young-Ho Lee , Steve Chun , Dek-Gin Yang , Chan-Yeup Chung , Yun-Seok Hwang , Keun-Ho Kim
- 申请人： Young-Ho Lee , Steve Chun , Dek-Gin Yang , Chan-Yeup Chung , Yun-Seok Hwang , Keun-Ho Kim
- 申请人地址： KR Gyunggi-Do KR Inchon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.,YMT Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.,YMT Co., Ltd.
- 当前专利权人地址： KR Gyunggi-Do KR Inchon
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2008-0024052 20080314
- 主分类号： C09K13/00
- IPC分类号： C09K13/00
摘要：
The present invention provides a composition for surface modification of a heat sink, the composition including: 0.01 to 10 parts by weight of an organic titanium compound; 0.01 to 5 parts by weight of an organic silane compound; 0.1 to 10 parts by weight of an organic acid; 0.01 to 5 parts by weight of a sequestering agent; and 0.1 to 10 parts by weight of a buffer with respect to 100 parts by weight of distilled water. The composition of the present invention provides excellent adhesion strength with prepreg, and improve heat releasing performance.
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