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    Method of manufacturing PCB and PCB manufactured by the same
    1.
    发明申请
    Method of manufacturing PCB and PCB manufactured by the same 审中-公开
    制造PCB和PCB的方法

    公开(公告)号：US20090277679A1

    公开(公告)日：2009-11-12

    申请号：US12219660

    申请日：2008-07-25

    申请人： Ha Yong Jung ,  Dek Gin Yang ,  Cheol Ho Heo ,  Chan-Yeup Chung ,  Keun Ho Kim ,  Seoung Jae Lee

    发明人： Ha Yong Jung ,  Dek Gin Yang ,  Cheol Ho Heo ,  Chan-Yeup Chung ,  Keun Ho Kim ,  Seoung Jae Lee

    IPC分类号： H05K3/42 ,  H05K1/11

    CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/429 ,  H05K2201/09554 ,  H05K2203/073

    摘要： Provided is a method of manufacturing a PCB, the method comprising: providing a substrate including an aluminum core; forming a via hole passing through the substrate; substituting the surface of the aluminum core with a zinc film by performing a zincate treatment on the inner surface of the via hole; substituting the zinc film with a metal film by performing substitution plating on the zinc film; forming a first plated film on the surface of the via hole, where the metal film is formed, through electroless plating; and forming a second plated film on the first plated film through electroplating.

    摘要翻译： 提供一种制造PCB的方法，该方法包括：提供包括铝芯的基板; 形成通过所述基板的通孔; 通过在通孔的内表面上进行锌酸盐处理，用锌膜代替铝芯的表面; 通过在锌膜上进行取代电镀用金属膜代替锌膜; 在形成金属膜的通孔的表面上通过无电镀形成第一镀膜; 以及通过电镀在所述第一镀膜上形成第二镀膜。

    THERMOELECTRIC ELEMENT
    3.
    发明申请
    THERMOELECTRIC ELEMENT 审中-公开
    热电元件

    公开(公告)号：US20100258155A1

    公开(公告)日：2010-10-14

    申请号：US12547000

    申请日：2009-08-25

    申请人： Sung Ho LEE ,  Yongsoo OH ,  Chan Yeup CHUNG

    发明人： Sung Ho LEE ,  Yongsoo OH ,  Chan Yeup CHUNG

    IPC分类号： H01L35/28

    CPC分类号： H01L35/32 ,  H01L23/38 ,  H01L2924/0002 ,  H01L2924/00

    摘要： There is provided a thermoelectric (TE) element. The TE element includes a plurality of pn junctions each formed by bonding an n-type TE semiconductor and a p-type TE semiconductor with a metallic layer interposed therebetween, and a first electrode and a second electrode electrically connected to the n-type TE semiconductor and the p-type TE semiconductor, respectively. The plurality of pn junctions are laminated with insulating layers interposed therebetween, and are connected electrically in parallel to each other. Even in the case that a section of components does not operate electrically, the operation of the entire element is not adversely affected, thereby improving stability of the TE element.

    摘要翻译： 提供热电（TE）元件。 TE元件包括多个pn结，每个pn结通过将n型TE半导体和p型TE半导体与介于其间的金属层结合而形成，以及电连接到n型TE半导体的第一电极和第二电极 和p型TE半导体。 多个pn结层叠有绝缘层，并且彼此并联连接。 即使在部分部件不进行电气的情况下，也不会对整个元件的动作产生不良影响，从而提高TE元件的稳定性。

    Printed circuit board and manufacturing method of the same
    6.
    发明申请
    Printed circuit board and manufacturing method of the same 审中-公开
    印刷电路板及其制造方法相同

    公开(公告)号：US20090133920A1

    公开(公告)日：2009-05-28

    申请号：US12216374

    申请日：2008-07-02

    申请人： Keun-Ho Kim ,  Dek-Gin Yang ,  Yun-Seok Hwang ,  Chan-Yeup Chung ,  Young-Ho Lee ,  Cheol-Ho Heo

    发明人： Keun-Ho Kim ,  Dek-Gin Yang ,  Yun-Seok Hwang ,  Chan-Yeup Chung ,  Young-Ho Lee ,  Cheol-Ho Heo

    IPC分类号： H05K1/11 ,  H05K3/10

    CPC分类号： H05K3/4641 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/09554 ,  Y10T29/49165

    摘要： A printed circuit board and a manufacturing method of the same. The method includes forming a circuit board by selectively positioning a heat release layer among multiple insulation layers that have circuit patterns formed on their surfaces, perforating a through-hole that penetrates through one side and the other side of the circuit board, forming a metal film over the heat release layer exposed at an inner wall surface of the through-hole, and forming a plating layer by depositing a conductive metal over an inner wall of the through-hole. By having the heat release layer selectively inserted inside the circuit board, the heat releasing effect may be improved, and the bending strength may be increased. Moreover, a reliable electrical connection can be implemented between the heat release layer and the circuit pattern, making it possible to utilize the heat release layer as a power supply layer or a ground layer.

    摘要翻译： 一种印刷电路板及其制造方法。 该方法包括通过在其表面上形成有电路图案的多个绝缘层中选择性地定位放热层来形成电路板，穿透穿过电路板的一侧和另一侧的通孔，形成金属膜 在通孔的内壁表面露出的放热层上，通过在通孔的内壁上沉积导电金属而形成镀层。 通过使散热层选择性地插入电路板内，可以提高散热效果，并且可以提高弯曲强度。 此外，可以在散热层和电路图案之间实现可靠的电连接，使得可以将散热层用作电源层或接地层。