Invention Grant
- Patent Title: Composition for surface modification of a heat sink and method for surface treatment of the heat sink for printed circuit boards using the same
- Patent Title (中): 用于散热器表面改性的组合物和使用其的印刷电路板的散热器的表面处理方法
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Application No.: US12235034Application Date: 2008-09-22
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Publication No.: US07981317B2Publication Date: 2011-07-19
- Inventor: Young-Ho Lee , Steve Chun , Dek-Gin Yang , Chan-Yeup Chung , Yun-Seok Hwang , Keun-Ho Kim
- Applicant: Young-Ho Lee , Steve Chun , Dek-Gin Yang , Chan-Yeup Chung , Yun-Seok Hwang , Keun-Ho Kim
- Applicant Address: KR Gyunggi-Do KR Inchon
- Assignee: Samsung Electro-Mechanics Co., Ltd.,YMT Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.,YMT Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do KR Inchon
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0024052 20080314
- Main IPC: C09K13/00
- IPC: C09K13/00
Abstract:
The present invention provides a composition for surface modification of a heat sink, the composition including: 0.01 to 10 parts by weight of an organic titanium compound; 0.01 to 5 parts by weight of an organic silane compound; 0.1 to 10 parts by weight of an organic acid; 0.01 to 5 parts by weight of a sequestering agent; and 0.1 to 10 parts by weight of a buffer with respect to 100 parts by weight of distilled water. The composition of the present invention provides excellent adhesion strength with prepreg, and improve heat releasing performance.
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