Invention Grant
- Patent Title: Silver fine powder, process for producing the same, and ink
- Patent Title (中): 银细粉,生产工艺及油墨
-
Application No.: US12522422Application Date: 2008-01-08
-
Publication No.: US07981326B2Publication Date: 2011-07-19
- Inventor: Kimitaka Sato , Taku Okano
- Applicant: Kimitaka Sato , Taku Okano
- Applicant Address: JP Tokyo
- Assignee: Dowa Electronics Materials Co., Ltd.
- Current Assignee: Dowa Electronics Materials Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Clark & Brody
- Priority: JP2007-001298 20070109; JP2007-173732 20070702
- International Application: PCT/JP2008/050308 WO 20080108
- International Announcement: WO2008/084866 WO 20080717
- Main IPC: H01B1/22
- IPC: H01B1/22

Abstract:
A silver fine powder comprising silver particles with an average particle diameter of 20 nm or less and having an organic protective material on the surface thereof, wherein the proportion of the organic protective material present is 0.05 to 25% by mass based on the total mass of the silver particles and the organic protective material. An amine compound having a molecular weight of 100 to 1,000 is preferably used as the organic protective material, and that having one or more unsaturated bond in one molecule is particularly preferred. This silver fine powder has, for example, a crystallite diameter in (111) crystal plane of silver particle of 20 nm or less. The present invention further provides an ink comprising particles of the silver fine powder dispersed in an organic solvent in the silver concentration of 10% by mass or more, the ink having a viscosity of 50 mPa·s or less.
Public/Granted literature
- US20100006002A1 SILVER FINE POWDER, PROCESS FOR PRODUCING THE SAME, AND INK Public/Granted day:2010-01-14
Information query