发明授权
- 专利标题： Method of manufacturing solid-state image pickup element, and solid-state image pickup element
- 专利标题（中）： 固体摄像元件的制造方法以及固体摄像元件
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申请号： US12364254申请日： 2009-02-02
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公开(公告)号： US07981718B2公开(公告)日： 2011-07-19
- 发明人: Hideki Kobayashi , Masafumi Muramatsu
- 申请人： Hideki Kobayashi , Masafumi Muramatsu
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Rockey, Depke & Lyons, LLC
- 代理商 Robert J. Depke
- 优先权： JP2008-040969 20080222
- 主分类号： H01L21/58
- IPC分类号： H01L21/58
摘要：
Disclosed herein is a method of manufacturing a solid-state image pickup element, the method including the steps of forming a plurality of photoelectric conversion elements within a semiconductor substrate; forming a wiring layer via an insulating film on a surface of the semiconductor substrate in which surface the plurality of photoelectric conversion elements are formed; laminating a supporting substrate to a surface of the semiconductor substrate in which surface the wiring layer is formed via an adhesive; applying a pressure to the semiconductor substrate and the supporting substrate in a state of the semiconductor substrate and the supporting substrate being laminated to each other via the adhesive; and curing the adhesive by heating the adhesive to a curing temperature of the adhesive after releasing the applied pressure.
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