发明授权
- 专利标题: Dual SOI structure
- 专利标题(中): 双重SOI结构
-
申请号: US11268914申请日: 2005-11-08
-
公开(公告)号: US07986029B2公开(公告)日: 2011-07-26
- 发明人: Chiang-Ming Chuang , Kuang-Hsin Chen , I-Lu Wu
- 申请人: Chiang-Ming Chuang , Kuang-Hsin Chen , I-Lu Wu
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L29/06
- IPC分类号: H01L29/06
摘要:
A semiconductor structure having a hybrid crystal orientation is provided. The semiconductor structure includes an insulator layer, e.g., a buried oxide (BOX), on a first semiconductor layer, and a second semiconductor layer on the buried oxide, wherein the first and second semiconductor layers have a first and a second crystal orientation, respectively. A first region of the second semiconductor layer is replaced with an epitaxially grown layer of the first semiconductor layer, thereby providing a substrate having a first region with a first crystal orientation and a second region with a second crystal orientation. An isolation structure is formed to isolate the first and second regions. Thereafter, NMOS and PMOS transistors may be formed on the substrate in the region having the crystal orientation that is the most appropriate.
公开/授权文献
- US20070102769A1 Dual SOI structure 公开/授权日:2007-05-10
信息查询
IPC分类: