发明授权
US07987014B2 Systems and methods for selecting wafer processing order for cyclical two pattern defect detection
有权
用于选择晶圆处理顺序的系统和方法，用于周期性两种模式缺陷检测
- 专利标题： Systems and methods for selecting wafer processing order for cyclical two pattern defect detection
- 专利标题（中）： 用于选择晶圆处理顺序的系统和方法，用于周期性两种模式缺陷检测
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申请号： US12120881申请日： 2008-05-15
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公开(公告)号： US07987014B2公开(公告)日： 2011-07-26
- 发明人: Douglas Edmund Paradis
- 申请人： Douglas Edmund Paradis
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Wade J. Brady, III; Frederick J. Telecky, Jr.
- 主分类号： G06F19/00
- IPC分类号： G06F19/00 ; G06F7/00 ; H01L21/00
摘要：
A method of sequencing wafer processing order to minimize sequence correlation in a cyclical two pattern model by generating a set of sequences of wafer identifiers that each specify an order by which one or more fabrication equipments processes wafers of a wafer lot, where the wafer lot contains a number of slots and the fabrication equipments each includes a first subsystem for processing wafers in odd-numbered slots of the first wafer lot and a second subsystem for processing wafers in even-numbered slots of the first wafer lot, and where each of the generated wafer sequences contains exactly a number of wafer identifiers that match the wafer identifiers in every other wafer sequence indexed in the set.