-
公开(公告)号：US08219351B2
公开(公告)日：2012-07-10
申请号：US12365445
申请日：2009-02-04
IPC分类号： H01L23/043
CPC分类号： G05B19/41875 , B07C5/344 , G01R31/2894 , G05B2219/32198 , G05B2219/37097 , G05B2219/45031 , Y02P90/22
摘要： One embodiment relates to a computer method for aligning wafers processed in a semiconductor fabrication facility. In the method, a first arrangement of dies having a common functionality level is identified on a first wafer. A first alignment signature is assigned to the first wafer based on the first arrangement. A second arrangement of dies having the common functionality level is identified on a second wafer. A second alignment signature is assigned to the second wafer based on the second arrangement. The first alignment signature is compared to the second alignment signature, and the first and second wafers are selectively aligned based on a result of the comparison. Other systems and methods are also disclosed.
摘要翻译： 一个实施例涉及一种用于对准在半导体制造设备中处理的晶片的计算机方法。 在该方法中，在第一晶片上识别具有共同功能级别的管芯的第一布置。 基于第一布置将第一对准签名分配给第一晶片。 在第二晶片上识别具有共同功能级别的芯片的第二布置。 基于第二布置将第二对准签名分配给第二晶片。 将第一对准签名与第二对准签名进行比较，并且基于比较的结果来选择性地对准第一和第二晶片。 还公开了其它系统和方法。
-
2.发明授权Systems and methods for selecting wafer processing order for cyclical two pattern defect detection 有权用于选择晶圆处理顺序的系统和方法，用于周期性两种模式缺陷检测公开(公告)号：US07987014B2
公开(公告)日：2011-07-26
申请号：US12120881
申请日：2008-05-15
CPC分类号： G05B19/41865 , G05B23/0294 , G05B2219/32247 , G05B2219/32322 , G05B2219/32332 , G05B2219/45031 , Y02P90/20
摘要： A method of sequencing wafer processing order to minimize sequence correlation in a cyclical two pattern model by generating a set of sequences of wafer identifiers that each specify an order by which one or more fabrication equipments processes wafers of a wafer lot, where the wafer lot contains a number of slots and the fabrication equipments each includes a first subsystem for processing wafers in odd-numbered slots of the first wafer lot and a second subsystem for processing wafers in even-numbered slots of the first wafer lot, and where each of the generated wafer sequences contains exactly a number of wafer identifiers that match the wafer identifiers in every other wafer sequence indexed in the set.
摘要翻译： 一种对晶圆处理顺序进行排序的方法，以通过生成晶片标识符的序列集来最小化循环两个模式模型中的序列相关性，每个晶片标识符指定一个或多个制造设备处理晶片批次的晶片的顺序，其中晶片批次包含 多个槽和制造设备各自包括用于处理第一晶片块的奇数编号槽中的晶片的第一子系统和用于处理第一晶片批次的偶数槽中的晶片的第二子系统，并且其中每个 晶片序列包含与集合中索引的每个其他晶片序列中的晶片标识符匹配的晶片标识符的数量。
-
公开(公告)号：US20100169036A1
公开(公告)日：2010-07-01
申请号：US12365445
申请日：2009-02-04
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , B07C5/344 , G01R31/2894 , G05B2219/32198 , G05B2219/37097 , G05B2219/45031 , Y02P90/22
摘要： One embodiment relates to a computer method for aligning wafers processed in a semiconductor fabrication facility. In the method, a first arrangement of dies having a common functionality level is identified on a first wafer. A first alignment signature is assigned to the first wafer based on the first arrangement. A second arrangement of dies having the common functionality level is identified on a second wafer. A second alignment signature is assigned to the second wafer based on the second arrangement. The first alignment signature is compared to the second alignment signature, and the first and second wafers are selectively aligned based on a result of the comparison. Other systems and methods are also disclosed.
摘要翻译： 一个实施例涉及一种用于对准在半导体制造设备中处理的晶片的计算机方法。 在该方法中，在第一晶片上识别具有共同功能级别的管芯的第一布置。 基于第一布置将第一对准签名分配给第一晶片。 在第二晶片上识别具有共同功能级别的芯片的第二布置。 基于第二布置将第二对准签名分配给第二晶片。 将第一对准签名与第二对准签名进行比较，并且基于比较的结果来选择性地对准第一和第二晶片。 还公开了其它系统和方法。
-
4.发明申请SYSTEMS AND METHODS FOR SELECTING WAFER PROCESSING ORDER FOR CYCLICAL TWO PATTERN DEFECT DETECTION 有权用于选择循环两次图形缺陷检测的波浪加工订单的系统和方法公开(公告)号：US20090287338A1
公开(公告)日：2009-11-19
申请号：US12120881
申请日：2008-05-15
IPC分类号： G06F17/00
CPC分类号： G05B19/41865 , G05B23/0294 , G05B2219/32247 , G05B2219/32322 , G05B2219/32332 , G05B2219/45031 , Y02P90/20
摘要： A method of sequencing wafer processing order to minimize sequence correlation in a cyclical two pattern model by generating a set of sequences of wafer identifiers that each specify an order by which one or more fabrication equipments processes wafers of a wafer lot, where the wafer lot contains a number of slots and the fabrication equipments each includes a first subsystem for processing wafers in odd-numbered slots of the first wafer lot and a second subsystem for processing wafers in even-numbered slots of the first wafer lot, and where each of the generated wafer sequences contains exactly a number of wafer identifiers that match the wafer identifiers in every other wafer sequence indexed in the set.
摘要翻译： 一种对晶圆处理顺序进行排序的方法，以通过生成晶片标识符的序列集来最小化循环两个模式模型中的序列相关性，每个晶片标识符指定一个或多个制造设备处理晶片批次的晶片的顺序，其中晶片批次包含 多个槽和制造设备各自包括用于处理第一晶片块的奇数编号槽中的晶片的第一子系统和用于处理第一晶片批次的偶数槽中的晶片的第二子系统，并且其中每个 晶片序列包含与集合中索引的每个其他晶片序列中的晶片标识符匹配的晶片标识符的数量。
-
-
-
搜索结果
4 条记录 (耗时 0.011 秒)