发明授权
- 专利标题: High thermal conductivity metal matrix composites
- 专利标题(中): 高导热性金属基复合材料
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申请号: US12688454申请日: 2010-01-15
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公开(公告)号: US07988758B2公开(公告)日: 2011-08-02
- 发明人: Sion M. Pickard , James C. Withers , Raouf O. Loutfy
- 申请人: Sion M. Pickard , James C. Withers , Raouf O. Loutfy
- 申请人地址: US AZ Tucson
- 专利权人: Nano Materials International Corporation
- 当前专利权人: Nano Materials International Corporation
- 当前专利权人地址: US AZ Tucson
- 代理机构: Hayes Soloway P.C.
- 主分类号: C22C1/05
- IPC分类号: C22C1/05 ; H01L23/043
摘要:
Discontinuous diamond particulate containing metal matrix composites of high thermal conductivity and methods for producing these composites are provided. The manufacturing method includes producing a thin reaction formed and diffusion bonded functionally graded interactive SiC surface layer on diamond particles. The interactive surface converted SiC coated diamond particles are then disposed into a mold and between the particles and permitted to rapidly solidify under pressure. The surface conversion interactive SiC coating on the diamond particles achieves minimal interface thermal resistance with the metal matrix which translates into good mechanical strength and stiffness of the composites and facilitates near theoretical thermal conductivity levels to be attained in the composite. Secondary working of the diamond metal composite can be performed for producing thin sheet product.
公开/授权文献
- US20100110637A1 HIGH THERMAL CONDUCTIVITY METAL MATRIX COMPOSITES 公开/授权日:2010-05-06
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