发明授权
- 专利标题： Small form factor molded memory card and a method thereof
- 专利标题（中）： 小型造型存储卡及其方法
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申请号： US12507771申请日： 2009-07-22
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公开(公告)号： US07989268B2公开(公告)日： 2011-08-02
- 发明人: Ben Wei Chen , Jin S. Wang , David Hong-Dien Chen
- 申请人： Ben Wei Chen , Jin S. Wang , David Hong-Dien Chen
- 申请人地址： US CA Fountain Valley
- 专利权人： Kingston Technology Corporation
- 当前专利权人： Kingston Technology Corporation
- 当前专利权人地址： US CA Fountain Valley
- 代理机构： Sawyer Law Group, P.C.
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L23/02 ; H01L23/34 ; H01L29/68
摘要：
A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit substrate and electrically connected with the circuit layer. The encapsulant covering is formed by using a mold to press encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate. The encapsulant covering encapsulates all the above components with only the electric contacts exposed. A trace mark of the encapsulant inlet remaining on the encapsulant covering is then cut to obtain a shape-molding structure of memory card with an smooth and intact outer appearance.
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